MemTest86 V8.0 Pro Build: 1000
PassMark (R) Software
www.passmark.com

Memory summary:
Number of RAM modules: 4
Total Physical Memory: 65498M

DIMM #: 1
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1200 (JEDEC)
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
Memory Capacity (MB): 16384
Jedec Manufacture Name: Kingston
SPD Revision: 1.1
Registered: No
ECC: Yes
DIMM Slot #: 1
Manufactured: Week 10 of Year 2017
Module Part #: 9965669-019.A00G    
Module Revision: 0x0000
Module Serial #: 0xEB118F00
Module Manufacturing Location: 0x04
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 
Timings @ Max Frequency (JEDEC): 17-17-17-39
  Maximum Clock Speed (MHz): 1200
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
  Minimum Clock Cycle Time, tCK (ns): 0.833
  Minimum CAS Latency Time, tAA (ns): 13.750
  Minimum RAS to CAS Delay, tRCD (ns): 13.750
  Minimum Row Precharge Time, tRP (ns): 13.750
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.300
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.300
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 255
  DRAM Manufacture: SK Hynix
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card E Rev. 18

DIMM #: 2
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1200 (JEDEC)
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
Memory Capacity (MB): 16384
Jedec Manufacture Name: Kingston
SPD Revision: 1.1
Registered: No
ECC: Yes
DIMM Slot #: 2
Manufactured: Week 10 of Year 2017
Module Part #: 9965669-019.A00G    
Module Revision: 0x0000
Module Serial #: 0xE8119700
Module Manufacturing Location: 0x04
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 
Timings @ Max Frequency (JEDEC): 17-17-17-39
  Maximum Clock Speed (MHz): 1200
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
  Minimum Clock Cycle Time, tCK (ns): 0.833
  Minimum CAS Latency Time, tAA (ns): 13.750
  Minimum RAS to CAS Delay, tRCD (ns): 13.750
  Minimum Row Precharge Time, tRP (ns): 13.750
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.300
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.300
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 255
  DRAM Manufacture: SK Hynix
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card E Rev. 18

DIMM #: 3
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1200 (JEDEC)
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
Memory Capacity (MB): 16384
Jedec Manufacture Name: Kingston
SPD Revision: 1.1
Registered: No
ECC: Yes
DIMM Slot #: 3
Manufactured: Week 10 of Year 2017
Module Part #: 9965669-019.A00G    
Module Revision: 0x0000
Module Serial #: 0xEA118900
Module Manufacturing Location: 0x04
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 
Timings @ Max Frequency (JEDEC): 17-17-17-39
  Maximum Clock Speed (MHz): 1200
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
  Minimum Clock Cycle Time, tCK (ns): 0.833
  Minimum CAS Latency Time, tAA (ns): 13.750
  Minimum RAS to CAS Delay, tRCD (ns): 13.750
  Minimum Row Precharge Time, tRP (ns): 13.750
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.300
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.300
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 255
  DRAM Manufacture: SK Hynix
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card E Rev. 18

DIMM #: 4
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1200 (JEDEC)
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
Memory Capacity (MB): 16384
Jedec Manufacture Name: Kingston
SPD Revision: 1.1
Registered: No
ECC: Yes
DIMM Slot #: 4
Manufactured: Week 10 of Year 2017
Module Part #: 9965669-019.A00G    
Module Revision: 0x0000
Module Serial #: 0xEC118C00
Module Manufacturing Location: 0x04
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 
Timings @ Max Frequency (JEDEC): 17-17-17-39
  Maximum Clock Speed (MHz): 1200
  Maximum Transfer Speed (MHz): DDR4-2400
  Maximum Bandwidth (MB/s): PC4-19200
  Minimum Clock Cycle Time, tCK (ns): 0.833
  Minimum CAS Latency Time, tAA (ns): 13.750
  Minimum RAS to CAS Delay, tRCD (ns): 13.750
  Minimum Row Precharge Time, tRP (ns): 13.750
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.300
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.300
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 255
  DRAM Manufacture: SK Hynix
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card E Rev. 18