MemTest86 V8.2 Pro Build: 1000 PassMark (R) Software www.passmark.com Memory summary: Number of RAM modules: 4 Total Physical Memory: 131035M DIMM #: 1 ============== RAM Type: DDR4 Maximum Clock Speed (MHz): 1600 (JEDEC) Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Memory Capacity (MB): 32768 Jedec Manufacture Name: SPD Revision: 1.1 Registered: No ECC: Yes DIMM Slot #: 1 Manufactured: Week 2 of Year 2020 Module Part #: Module Revision: 0x0000 Module Serial #: 0x1F530000 Module Manufacturing Location: 0x00 # of Row Addressing Bits: 17 # of Column Addressing Bits: 10 # of Banks: 16 # of Ranks: 2 Device Width in Bits: 8 Bus Width in Bits: 64 Module Voltage: 1.2V CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26 28 Timings @ Max Frequency (JEDEC): 22-22-22-52 Maximum Clock Speed (MHz): 1600 Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Minimum Clock Cycle Time, tCK (ns): 0.625 Minimum CAS Latency Time, tAA (ns): 13.750 Minimum RAS to CAS Delay, tRCD (ns): 13.750 Minimum Row Precharge Time, tRP (ns): 13.750 Minimum Active to Precharge Time, tRAS (ns): 32.000 Minimum Row Active to Row Active Delay, tRRD (ns): 2.500 Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750 Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000 DDR4 Specific SPD Attributes Maximum Clock Cycle Time, tCKmax (ns): 1.600 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000 Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 2.500 Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900 Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000 Minimum Four Activate Window Delay (ns): 21.000 Maximum Activate Window in units of tREFI: 8192 Thermal Sensor Present: Yes DRAM Stepping: 0 DRAM Manufacture: SDRAM Package Type: Monolithic, 1 die, Single load stack Maxium Activate Count (MAC): Unlimited MAC Post Package Repair Supported: Yes Module Type: UDIMM Module Height (mm): 31 - 32 Module Thickness (mm): front 1-2 , back 1-2 Reference Raw Card Used: Raw Card B Rev. 19 DIMM #: 2 ============== RAM Type: DDR4 Maximum Clock Speed (MHz): 1600 (JEDEC) Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Memory Capacity (MB): 32768 Jedec Manufacture Name: SPD Revision: 1.1 Registered: No ECC: Yes DIMM Slot #: 2 Manufactured: Week 1 of Year 2020 Module Part #: Module Revision: 0x0000 Module Serial #: 0x685200CC Module Manufacturing Location: 0x00 # of Row Addressing Bits: 17 # of Column Addressing Bits: 10 # of Banks: 16 # of Ranks: 2 Device Width in Bits: 8 Bus Width in Bits: 64 Module Voltage: 1.2V CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26 28 Timings @ Max Frequency (JEDEC): 22-22-22-52 Maximum Clock Speed (MHz): 1600 Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Minimum Clock Cycle Time, tCK (ns): 0.625 Minimum CAS Latency Time, tAA (ns): 13.750 Minimum RAS to CAS Delay, tRCD (ns): 13.750 Minimum Row Precharge Time, tRP (ns): 13.750 Minimum Active to Precharge Time, tRAS (ns): 32.000 Minimum Row Active to Row Active Delay, tRRD (ns): 2.500 Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750 Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000 DDR4 Specific SPD Attributes Maximum Clock Cycle Time, tCKmax (ns): 1.600 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000 Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 2.500 Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900 Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000 Minimum Four Activate Window Delay (ns): 21.000 Maximum Activate Window in units of tREFI: 8192 Thermal Sensor Present: Yes DRAM Stepping: 0 DRAM Manufacture: SDRAM Package Type: Monolithic, 1 die, Single load stack Maxium Activate Count (MAC): Unlimited MAC Post Package Repair Supported: Yes Module Type: UDIMM Module Height (mm): 31 - 32 Module Thickness (mm): front 1-2 , back 1-2 Reference Raw Card Used: Raw Card B Rev. 19 DIMM #: 3 ============== RAM Type: DDR4 Maximum Clock Speed (MHz): 1600 (JEDEC) Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Memory Capacity (MB): 32768 Jedec Manufacture Name: SPD Revision: 1.1 Registered: No ECC: Yes DIMM Slot #: 3 Manufactured: Week 1 of Year 2020 Module Part #: Module Revision: 0x0000 Module Serial #: 0x68520109 Module Manufacturing Location: 0x00 # of Row Addressing Bits: 17 # of Column Addressing Bits: 10 # of Banks: 16 # of Ranks: 2 Device Width in Bits: 8 Bus Width in Bits: 64 Module Voltage: 1.2V CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26 28 Timings @ Max Frequency (JEDEC): 22-22-22-52 Maximum Clock Speed (MHz): 1600 Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Minimum Clock Cycle Time, tCK (ns): 0.625 Minimum CAS Latency Time, tAA (ns): 13.750 Minimum RAS to CAS Delay, tRCD (ns): 13.750 Minimum Row Precharge Time, tRP (ns): 13.750 Minimum Active to Precharge Time, tRAS (ns): 32.000 Minimum Row Active to Row Active Delay, tRRD (ns): 2.500 Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750 Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000 DDR4 Specific SPD Attributes Maximum Clock Cycle Time, tCKmax (ns): 1.600 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000 Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 2.500 Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900 Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000 Minimum Four Activate Window Delay (ns): 21.000 Maximum Activate Window in units of tREFI: 8192 Thermal Sensor Present: Yes DRAM Stepping: 0 DRAM Manufacture: SDRAM Package Type: Monolithic, 1 die, Single load stack Maxium Activate Count (MAC): Unlimited MAC Post Package Repair Supported: Yes Module Type: UDIMM Module Height (mm): 31 - 32 Module Thickness (mm): front 1-2 , back 1-2 Reference Raw Card Used: Raw Card B Rev. 19 DIMM #: 4 ============== RAM Type: DDR4 Maximum Clock Speed (MHz): 1600 (JEDEC) Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Memory Capacity (MB): 32768 Jedec Manufacture Name: SPD Revision: 1.1 Registered: No ECC: Yes DIMM Slot #: 4 Manufactured: Week 1 of Year 2020 Module Part #: Module Revision: 0x0000 Module Serial #: 0x68520015 Module Manufacturing Location: 0x00 # of Row Addressing Bits: 17 # of Column Addressing Bits: 10 # of Banks: 16 # of Ranks: 2 Device Width in Bits: 8 Bus Width in Bits: 64 Module Voltage: 1.2V CAS Latencies Supported: 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26 28 Timings @ Max Frequency (JEDEC): 22-22-22-52 Maximum Clock Speed (MHz): 1600 Maximum Transfer Speed (MHz): DDR4-3200 Maximum Bandwidth (MB/s): PC4-25600 Minimum Clock Cycle Time, tCK (ns): 0.625 Minimum CAS Latency Time, tAA (ns): 13.750 Minimum RAS to CAS Delay, tRCD (ns): 13.750 Minimum Row Precharge Time, tRP (ns): 13.750 Minimum Active to Precharge Time, tRAS (ns): 32.000 Minimum Row Active to Row Active Delay, tRRD (ns): 2.500 Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 45.750 Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000 DDR4 Specific SPD Attributes Maximum Clock Cycle Time, tCKmax (ns): 1.600 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000 Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000 Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 2.500 Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900 Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000 Minimum Four Activate Window Delay (ns): 21.000 Maximum Activate Window in units of tREFI: 8192 Thermal Sensor Present: Yes DRAM Stepping: 0 DRAM Manufacture: SDRAM Package Type: Monolithic, 1 die, Single load stack Maxium Activate Count (MAC): Unlimited MAC Post Package Repair Supported: Yes Module Type: UDIMM Module Height (mm): 31 - 32 Module Thickness (mm): front 1-2 , back 1-2 Reference Raw Card Used: Raw Card B Rev. 19